Science & Technology

Xiaomi launches Xring O3 chip and unveils Xiaomi 18 Fold smartphone

Xiaomi has launched the new Xring O3 chip and opened pre-orders for the Xiaomi 18 Fold foldable smartphone, expected in September.

25 August 2026Tagblick Newsdesk

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Archive photo: Xiaomi launches Xring O3 chip and unveils Xiaomi 18 Fold smartphone — Archive photoPhoto: S5A-0043 · Wikimedia Commons · CC BY 4.0

Xiaomi has introduced the new Xring O3 chip, developed in collaboration with TSMC. This new system on chip (SoC) is built using a 3 nm process node and integrates approximately 24 billion transistors, a 10-core ARM CPU, and a 16-core GPU, with support for LPDDR6 memory.

The size of the chip is 133 mm², highlighting its miniaturization and design efficiency. The Xring O3 chip is designed to enhance the performance of high-end smartphones, positioning itself in competition with products from companies like Apple and Samsung.

Alongside the chip launch, Xiaomi has opened pre-orders for the Xiaomi 18 Fold smartphone, which will utilize the new Xring O3. The device is expected to be released in September, according to available information.

Reportedly, the Xring O3 chip represents a significant step towards Xiaomi's independence from traditional chip suppliers such as Qualcomm and MediaTek, marking an important evolution in the company's strategy towards developing its own technologies.

Xiaomi has described the Xring O3 as an essential component for enhancing the overall performance of its smartphones, particularly regarding gaming and artificial intelligence applications.

This launch occurs amidst a growing interest from Xiaomi in creating proprietary hardware to better control the quality and innovation of its devices, signaling a shift in the competitive landscape of the technology industry.

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